Part Number | 828-AG11D-ESL-LF |
Main Category | Connectors, Interconnects |
Sub Category | Sockets for ICs, Transistors |
Brand | TE Connectivity |
Description | CONN IC DIP SOCKET 28POS GOLD |
Series | 800 |
Packaging | Tube |
Type | DIP, 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid) | 28 (2 x 14) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | Flash |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Open Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Gold |
Contact Finish Thickness - Post | Flash |
Contact Material - Post | Copper |
Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Operating Temperature | -55°C ~ 105°C |
Image |
828-AG11D-ESL-LF
TE CONNECTIVITY ALCOSWITCH
1324
1.14
SUNTOP SEMICONDUCTOR CO., LIMITED
828-AG11D-ESL-LF
TE CONNECTIVITY RAYCHEM WIRE AND TUBING
6234
1.87
Dedicate Electronics (HK) Limited
828-AG11D-ESL-LF
TE CONNECTIVITY P&B
6788
2.6
Iconix Inc.
828-AG11D-ESL-LF
TE/tyco
8154
3.33
Beam Technology Co.,Ltd